Xilinx XCZU9EG-1FFVC900I

부품 포인트

• The XCZU9EG-1FFVC900I is a Zynq UltraScale+ RFSoC chip from Xilinx. It features a quad-core ARM Cortex-A53 processor and programmable logic for FPGA applications. This chip is optimized for high-performance signal processing and radio frequency applications with integrated RF data converters and DSP blocks.

• Equivalent

  The equivalent product to the XCZU9EG-1FFVC900I chip is the Xilinx Zynq UltraScale+ ZU9EG. It is a programmable system-on-chip (SoC) that integrates a high-performance 64-bit ARM Cortex-A53 processor with Xilinx programmable logic. The -1FFVC900I designation indicates specific features and performance characteristics of this chip.

• Features

  XCZU9EG-1FFVC900I is a System on Chip (SoC) device from Xilinx's Zynq UltraScale+ family. It features a quad-core Arm Cortex-A53 processor, a dual-core Cortex-R5 real-time processor, programmable logic with 600K logic cells, and high-speed interfaces like 100G Ethernet and PCIe Gen3. It is ideal for advanced applications in networking, data center, and embedded systems.

• Pinout

  XCZU9EG-1FFVC900I is a 900-ball chip with a maximum of 835 user I/O pins, dedicated pins for configuration, and special-purpose input/output (I/O) pins for features like clocking and power regulation. It is a Zynq UltraScale+ MPSoC that combines FPGA fabric with ARM processing cores for high-performance applications.

• Manufacturer

  XCZU9EG-1FFVC900I is manufactured by Xilinx, Inc., a leading American technology company specializing in FPGA (Field-Programmable Gate Array) and SoC (System on Chip) products. Xilinx's products are used in a variety of industries, including telecommunications, automotive, aerospace, and data center markets.

• Application Field

  The XCZU9EG-1FFVC900I is a high-performance and versatile field-programmable gate array (FPGA) with applications in industries such as aerospace, automotive, telecommunications, and industrial automation. It is commonly used for advanced signal processing, image and video processing, machine learning, and edge computing applications.

• Package

  The XCZU9EG-1FFVC900I chip is a System on Chip (SoC) that comes in a Flip-Chip Ball Grid Array (FCBGA) package. It has a size of 35mm x 35mm with a 0.8mm ball pitch.