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Xilinx XC6VSX315T-1FFG1156I

Name: XC6VSX315T-1FFG1156I
Brand: AMD Xilinx, Inc
Rating: 4.8 (10 reviews)

This FPGA operates at 1V and comes in a 1156-pin FC-BGA package

브랜드: AMD Xilinx, Inc

제조업체부품 #: XC6VSX315T-1FFG1156I

데이터 시트: XC6VSX315T-1FFG1156I Datasheet (PDF)

패키지/케이스: FCBGA-1156

상품 유형: FPGAs (Field Programmable Gate Array)

RoHS 상태:

재고상태: 2,334 PC, 새로운 원본

Warranty: 1 Year Ovaga Warranty - Find Out More

빠른 견적

다음에 대한 RFQ를 제출해 주십시오. XC6VSX315T-1FFG1156I 또는 우리에게 이메일을 보내: 이메일: [email protected], 12시간 이내에 연락드리겠습니다.

수량^*

이메일^*

담당자 이름^*

회사

주목

XC6VSX315T-1FFG1156I 일반적인 설명

Striving for excellence, the XC6VSX315T-1FFG1156I, a state-of-the-art Virtex-6 FPGA developed by Xilinx, sets a new standard for high-performance programmable logic devices across a wide range of applications. Featuring an impressive 315,000 logic cells, this model is well-suited for complex designs with extensive computational requirements. With 24 high-speed transceivers, the device enables high-speed data transfer, seamless connectivity, and efficient communication between various system components. Furthermore, with 1,080 Kb of RAM and support for data rates of up to 12.8 Gbps, the XC6VSX315T-1FFG1156I delivers abundant memory and bandwidth for even the most demanding applications. Operating at a core voltage of 1.0V and incorporating multiple power planes for optimized power management, this FPGA ensures efficient and reliable performance. Boasting 593 user I/Os, the device facilitates seamless interfacing with external devices and peripherals. Housed in a 1156-pin flip-chip fine-pitch ball grid array (FFG1156) package, the XC6VSX315T-1FFG1156I offers a compact form factor and a high pin count, providing diverse connectivity options. Additionally, the device is RoHS-compliant, underlining its commitment to environmental sustainability

특징

It has a large number of programmable logic cells, which can be configured to implement complex digital circuits.
It also includes built-in memory blocks, high-speed serial transceivers, and other digital signal processing (DSP) resources.
XC6VSX315T-1FFG1156I operates on a 1.0V core voltage, with a maximum operating frequency of 550MHz.
It has 315,000 logic cells, 12.8Mb of Block RAM, and 360 DSP slices, making it suitable for high-end applications that require high performance and flexibility.

애플리케이션

XC6VSX315T-1FFG1156I can be used in a wide range of applications, including high-performance computing, telecommunications, aerospace, and defense, among others.
Its high-speed serial transceivers make it suitable for applications that require high-speed data transmission over long distances, such as data center networking and wireless communication.
Its large logic capacity and built-in DSP resources make it ideal for implementing complex digital signal processing algorithms used in video and image processing, radar systems, and other applications.

명세서

매개변수	값	매개변수	값
Case/Package	FCBGA	Contact Plating	Copper, Silver, Tin
Mount	Surface Mount	Number of Pins	1156
Max Operating Temperature	100 °C	Max Supply Voltage	1.05 V
Min Operating Temperature	-40 °C	Min Supply Voltage	950 mV
Number of I/Os	600	Number of Logic Blocks (LABs)	24600
Number of Logic Elements/Cells	314880	RAM Size	3.1 MB
Speed Grade	1

배송

	배송비	리드타임
DHL	$20.00-$40.00 (0.50 KG)	2-5 날
페덱스	$20.00-$40.00 (0.50 KG)	2-5 날
UPS	$20.00-$40.00 (0.50 KG)	2-5 날
TNT	$20.00-$40.00 (0.50 KG)	2-5 날
EMS	$20.00-$40.00 (0.50 KG)	2-5 날
등기 항공 우편	$20.00-$40.00 (0.50 KG)	2-5 날

처리 시간: 배송비는 지역 및 국가에 따라 다릅니다.

지불

지불 조건		핸드 수수료
	은행 송금	US$30.00의 은행 수수료를 부과합니다.
	페이팔	4.0%의 서비스 수수료를 부과합니다.
	신용 카드	3.5% 서비스 수수료를 부과합니다.
	웨스턴 유니언	charge US.00 banking fee.
	돈 그램	US$0.00의 은행 수수료를 부과합니다.

보증

1. 귀하가 구입한 전자 부품에는 365일 보증이 포함되어 있으며, 우리는 제품 품질을 보장합니다.

2. 귀하가 받은 품목 중 일부가 완벽한 품질이 아닌 경우, 당사는 책임 있게 귀하의 환불 또는 교체를 준비할 것입니다. 그러나 품목은 원래 상태를 유지해야 합니다.

포장

단계1 :제품
단계2 :진공 포장
단계3 :정전기 방지 가방
단계4 :개별 포장
단계5 :포장 상자
단계6 :바코드 배송 태그

모든 제품은 정전기 방지 가방에 포장됩니다. ESD 정전기 방지 보호 장치와 함께 배송됩니다.

외부 ESD 포장 라벨은 당사 정보(부품 번호, 브랜드 및 수량)를 사용합니다.

우리는 선적 전에 모든 상품을 검사하고, 모든 제품이 양호한 상태인지 확인하고, 부품이 새로운 원본 일치 데이터시트인지 확인합니다.

모든 상품을 포장한 후 문제가 없는지 확인한 후 안전하게 포장하여 글로벌 특급으로 보내드립니다. 우수한 밀봉 무결성과 함께 탁월한 천공 및 인열 저항성을 나타냅니다.

등가 부품

에 대한 XC6VSX315T-1FFG1156I 구성 요소인 경우 이러한 교체 및 대체 부품을 고려할 수 있습니다.:

부품 번호

브랜드

패키지

설명

부품 번호 : XC6VSX315T-2FFG1156C

브랜드 :

패키지 :

설명 : XC6VSX315T-2FFG1156C

부품 번호 : XC6VSX315T-1FFG1759C

브랜드 :

패키지 :

설명 : XC6VSX315T-1FFG1759C

부품 번호 : XC6VSX315T-2FFG1156I

브랜드 :

패키지 :

설명 : XC6VSX315T-2FFG1156I

부품 번호 : XC6VSX315T-1FFG1759I

브랜드 :

패키지 :

설명 : XC6VSX315T-1FFG1759I

부품 번호 : XC6VSX315T-1FFG1156C

브랜드 :

패키지 :

설명 : XC6VSX315T-1FFG1156C

부품 포인트

XC6VSX315T-1FFG1156I is a high-performance, field-programmable gate array (FPGA) chip from Xilinx. It offers a large capacity and advanced features, making it suitable for a wide range of applications. The chip has 315,000 logic cells, 1,200 input/output pins, and various built-in functions for efficient design implementation. It offers high-speed performance, low power consumption, and flexibility, making it a popular choice in the electronics industry.
Equivalent

Equivalent products of the XC6VSX315T-1FFG1156I chip include the XC6VLX315T-1FFG1156I and the XC6VSX315T-2FFG1156I.
Features

The key features of the XC6VSX315T-1FFG1156I FPGA are its high-performance logic capabilities, advanced memory resources, wide range of I/O options, and flexible clocking technology. It also offers easy system integration, efficient power management, and is suitable for a variety of applications including telecommunications, aerospace, and defense.
Pinout

The XC6VSX315T-1FFG1156I is a field-programmable gate array (FPGA) with a pin count of 1156. Its function is to enable programmable logic and digital signal processing on a single chip, making it suitable for a wide range of applications including aerospace, automotive, and telecommunications.
Manufacturer

The manufacturer of the XC6VSX315T-1FFG1156I is Xilinx. Xilinx is a technology company that specializes in the development and manufacturing of programmable logic devices and associated software tools. They are a leading provider of field-programmable gate arrays (FPGAs) and programmable system-on-chips (SoCs) that enable flexible and customizable hardware solutions for various applications in industries such as automotive, telecommunications, and aerospace. Note: The provided response is based on general knowledge and does not pertain specifically to the XC6VSX315T-1FFG1156I.
Application Field

The XC6VSX315T-1FFG1156I is a programmable logic device that is commonly used in high-performance applications such as aerospace and defense, telecommunications, scientific research, and industrial automation. It offers advanced features and capabilities to meet the demanding requirements of these industries.
Package

The XC6VSX315T-1FFG1156I chip has a Flip Chip Ball Grid Array (FBGA) package type, with 1156 solder balls for connection. The size of the chip is classified as 1FFG, which indicates a medium-sized package.