Xilinx XC3S5000-5FGG900C

부품 포인트

• The XC3S5000-5FGG900C chip is a field-programmable gate array (FPGA) that belongs to the Spartan-3 generation of Xilinx FPGAs. It has 5,000 slices, each of which contains four 6-input LUTs and eight flip-flops, making it suitable for complex digital designs. The chip operates at a maximum speed grade of -5 and comes in a 900-ball flip-chip grid array (FGG900C) package.

• Equivalent

  The possible equivalent products of the XC3S5000-5FGG900C chip are: 1. XC3S500E-5FGG900C, 2. XC3S5000-5FG900C, 3. XC3S500E-5FG900C, 4. XC3S5000-5FG676C, 5. XC3S500E-5FG676C. These chips have similar specifications and can be considered as alternatives to the XC3S5000-5FGG900C.

• Features

  XC3S5000-5FGG900C is a field-programmable gate array (FPGA) with 5 million system gates, 900 FBGA package, and a maximum speed grade of -5. It offers extensive connectivity options including Gigabit Ethernet, PCI Express, and DDR2 memory interfaces. It is suitable for applications requiring high-performance digital signal processing, embedded processing, and high-speed serial connectivity.

• Pinout

  The XC3S5000-5FGG900C is an FPGA with a pin count of 900. It is manufactured by Xilinx. The specific functions of the pins can vary depending on the circuit design and configuration.

• Manufacturer

  The XC3S5000-5FGG900C is manufactured by Xilinx, Inc. It is an American technology company that specializes in the development and production of programmable logic devices (PLDs) and associated software tools. Xilinx is known for its field-programmable gate array (FPGA) products which are widely used in various industries such as aerospace, automotive, telecommunications, and more.

• Application Field

  The XC3S5000-5FGG900C is a field-programmable gate array (FPGA) that can be used in various application areas, including telecommunications, aerospace and defense, automotive, consumer electronics, and industrial automation. It provides high performance, flexibility, and scalability, making it suitable for a wide range of applications in these industries.

• Package

  The XC3S5000-5FGG900C chip is a Field-Programmable Gate Array (FPGA) with a package type of Flip Chip Ball Grid Array (FC-BGA). It has a 900-ball grid array package with a form factor of 31mm x 31mm, making it a small and compact chip.