WINBOND W25Q32JVSSIM

부품 포인트

• The W25Q32JVSSIM is a flash memory chip commonly used in electronic devices for storing data. It has a capacity of 32 megabits and utilizes Serial Peripheral Interface (SPI) for communication with other devices. The chip offers high performance and low power consumption, making it suitable for applications that require reliable and efficient memory storage.

• Equivalent

  Some equivalent products of the W25Q32JVSSIM chip include the MX25L3233FM2I, S25FL032P0XMFI011, and the MT25QL128ABA1EW9-0SIT. These chips are comparable in terms of their flash memory capacity and serial flash interface.

• Features

  The W25Q32JVSSIM is a 32-megabit, Quad-SPI interface flash memory chip. Its features include a low power consumption, high-speed performance, wide operating voltage range, rapid write and read speeds, and superior reliability. It offers flexible erase and program capabilities, making it suitable for various applications requiring non-volatile memory solutions.

• Pinout

  The W25Q32JVSSIM is a 32Mb SPI flash memory chip with an 8-pin package. It supports high-performance read/program/erase operations, as well as a Dual/Quad SPI interface for faster data transfer. The pin functions include power supply, ground, clock, data input/output, write protect, and hold.

• Manufacturer

  The manufacturer of the W25Q32JVSSIM is Winbond Electronics Corporation. It is a semiconductor company that specializes in the design, development, and manufacturing of memory integrated circuits (ICs) and related products.

• Application Field

  The W25Q32JVSSIM is a Serial Flash Memory chip commonly used in various electronic applications, including automotive, consumer electronics (such as digital cameras and smartphones), industrial automation, and networking devices. It offers high-storage capacity, fast data transfer rates, and low power consumption, making it suitable for a wide range of applications.

• Package

  The W25Q32JVSSIM chip is available in an 8-pin SOIC (Small Outline Integrated Circuit) package. Its form factor is a surface mount device (SMD). The size of the chip is approximately 5.29mm x 6.20mm.