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IS61NLP102436B-200B3LI

Name: IS61NLP102436B-200B3LI
Brand: INTEGRATED SILICON SOLUTION INC
Rating: 4.8 (10 reviews)

256Mb of reliable storage ideal for industrial control systems, automotive electronics

브랜드: INTEGRATED SILICON SOLUTION INC

제조업체부품 #: IS61NLP102436B-200B3LI

데이터 시트: IS61NLP102436B-200B3LI 데이터 시트 (PDF)

패키지/케이스: FBGA-165

RoHS 상태:

재고상태: 6,115 PC, 새로운 원본

상품 유형: 메모리

Warranty: 1 Year Ovaga Warranty - Find Out More

가격

*모든 가격은 USD 단위입니다.

수량	단가	추가 가격
1	$165.577	$165.577
200	$64.076	$12815.200
500	$61.825	$30912.500
1000	$60.712	$60712.000

재고: 6,115 PCS

- +

빠른 견적

다음에 대한 RFQ를 제출해 주십시오. IS61NLP102436B-200B3LI 또는 우리에게 이메일을 보내: 이메일: [email protected], 12시간 이내에 연락드리겠습니다.

수량^*

이메일^*

담당자 이름^*

회사

주목

IS61NLP102436B-200B3LI 일반적인 설명

Integrated Silicon Solution Inc. (ISSI) introduces the dynamic IS61NLP102436B-200B3LI synchronous DRAM module, a memory unit with a storage capacity of 1 Gb and a 36-bit data width. Running at a brisk 200 MHz, this module is optimized for mobile devices and other power-sensitive applications, thanks to its design that prioritizes low power consumption. The IS61NLP102436B-200B3LI boasts support for burst lengths of 2 or 4, with a choice of programmable READ or WRITE burst sequences for added flexibility in data processing. Its programmable CAS latency of 3 ensures efficient data access and transfer speeds, making it a reliable choice for high-performance computing needs. Additionally, the memory module features a self-refresh mode for power-saving benefits when the device is not in active use. Compliant with RoHS standards and compatible with a range of industry-standard interfaces, the IS61NLP102436B-200B3LI is a top-tier memory solution that prioritizes efficiency and sustainability

특징

100 percent bus utilization
No wait cycles between Read and Write
Internal self-timed write cycle
Individual Byte Write Control
Single R/W (Read/Write) control pin
Clock controlled, registered address, data and control
Interleaved or linear burst sequence control using MODE input
Three chip enables for simple depth expansion and address pipelining
Power Down mode
Common data inputs and data outputs
CKE pin to enable clock and suspend operation
JEDEC 100-pin TQFP and 165-ball PBGA packages
Power supply: NVP: VDD 2.5V (± 5%), VDDQ 2.5V (± 5%) NLP: VDD 3.3V (± 5%), VDDQ 3.3V/2.5V (± 5%)
Industrial temperature available
Lead-free available

명세서

매개변수	값	매개변수	값
Rohs Code	Yes	Part Life Cycle Code	Active
Ihs Manufacturer	INTEGRATED SILICON SOLUTION INC	Part Package Code	BGA
Package Description	TBGA, BGA165,11X15,40	Pin Count	165
Reach Compliance Code	compliant	ECCN Code	3A991.B.2.A
HTS Code	8542.32.00.41	Factory Lead Time	16 Weeks
Samacsys Manufacturer	Integrated Silicon Solution Inc.	Access Time-Max	3.1 ns
Clock Frequency-Max (fCLK)	200 MHz	I/O Type	COMMON
JESD-30 Code	R-PBGA-B165	Length	15 mm
Memory Density	37748736 bit	Memory IC Type	ZBT SRAM
Memory Width	36	Number of Functions	1
Number of Terminals	165	Number of Words	1048576 words
Number of Words Code	1000000	Operating Mode	SYNCHRONOUS
Operating Temperature-Max	85 °C	Operating Temperature-Min	-40 °C
Organization	1MX36	Output Characteristics	3-STATE
Package Body Material	PLASTIC/EPOXY	Package Code	TBGA
Package Equivalence Code	BGA165,11X15,40	Package Shape	RECTANGULAR
Package Style	GRID ARRAY, THIN PROFILE	Parallel/Serial	PARALLEL
Power Supplies	2.5/3.3,3.3 V	Qualification Status	Not Qualified
Seated Height-Max	1.2 mm	Standby Current-Max	0.12 A
Standby Voltage-Min	3.14 V	Supply Current-Max	0.26 mA
Supply Voltage-Max (Vsup)	3.465 V	Supply Voltage-Min (Vsup)	3.135 V
Supply Voltage-Nom (Vsup)	3.3 V	Surface Mount	YES
Technology	CMOS	Temperature Grade	INDUSTRIAL
Terminal Form	BALL	Terminal Pitch	1 mm
Terminal Position	BOTTOM	Width	13 mm
Package	Tray	Product Status	Active
Programmabe	Not Verified	Memory Type	Volatile
Memory Format	SRAM	Memory Size	36Mbit
Memory Organization	1M x 36	Memory Interface	Parallel
Clock Frequency	200 MHz	Access Time	3.1 ns
Voltage - Supply	3.135V ~ 3.465V	Operating Temperature	-40°C ~ 85°C (TA)
Mounting Type	Surface Mount	Package / Case	165-TBGA
Supplier Device Package	165-TFBGA (13x15)

배송

	배송비	리드타임
DHL	$20.00-$40.00 (0.50 KG)	2-5 날
페덱스	$20.00-$40.00 (0.50 KG)	2-5 날
UPS	$20.00-$40.00 (0.50 KG)	2-5 날
TNT	$20.00-$40.00 (0.50 KG)	2-5 날
EMS	$20.00-$40.00 (0.50 KG)	2-5 날
등기 항공 우편	$20.00-$40.00 (0.50 KG)	2-5 날

처리 시간: 배송비는 지역 및 국가에 따라 다릅니다.

지불

지불 조건		핸드 수수료
	은행 송금	US$30.00의 은행 수수료를 부과합니다.
	페이팔	4.0%의 서비스 수수료를 부과합니다.
	신용 카드	3.5% 서비스 수수료를 부과합니다.
	웨스턴 유니언	charge US.00 banking fee.
	돈 그램	US$0.00의 은행 수수료를 부과합니다.

보증

1. 귀하가 구입한 전자 부품에는 365일 보증이 포함되어 있으며, 우리는 제품 품질을 보장합니다.

2. 귀하가 받은 품목 중 일부가 완벽한 품질이 아닌 경우, 당사는 책임 있게 귀하의 환불 또는 교체를 준비할 것입니다. 그러나 품목은 원래 상태를 유지해야 합니다.

포장

단계1 :제품
단계2 :진공 포장
단계3 :정전기 방지 가방
단계4 :개별 포장
단계5 :포장 상자
단계6 :바코드 배송 태그

모든 제품은 정전기 방지 가방에 포장됩니다. ESD 정전기 방지 보호 장치와 함께 배송됩니다.

외부 ESD 포장 라벨은 당사 정보(부품 번호, 브랜드 및 수량)를 사용합니다.

우리는 선적 전에 모든 상품을 검사하고, 모든 제품이 양호한 상태인지 확인하고, 부품이 새로운 원본 일치 데이터시트인지 확인합니다.

모든 상품을 포장한 후 문제가 없는지 확인한 후 안전하게 포장하여 글로벌 특급으로 보내드립니다. 우수한 밀봉 무결성과 함께 탁월한 천공 및 인열 저항성을 나타냅니다.

부품 포인트

The IS61NLP102436B-200B3LI chip is a low-power synchronous static RAM (SRAM) designed for use in various electronic devices. It features a capacity of 16 megabits and operates at a speed of 200 MHz. This chip is commonly used in applications where high performance and efficiency are crucial.
Equivalent

Some equivalent products of IS61NLP102436B-200B3LI chip are IS61NLP102436B-200B2LI, IS61NLP102436B-200B4LI, and IS61NLP102436B-200B5LI. These chips are all part of the same family and have similar specifications and functionalities, making them suitable replacements for one another.
Manufacturer

Integrated Silicon Solution Inc. (ISSI) is the manufacturer of the IS61NLP102436B-200B3LI. ISSI is a fabless semiconductor company that designs and markets high-performance integrated circuits for automotive, industrial, communications, and consumer electronics markets. They specialize in DRAM, SRAM, and flash memory, as well as analog and mixed-signal ICs.
Application Field

The IS61NLP102436B-200B3LI is commonly used in networking devices, telecommunications equipment, industrial automation, and automotive applications that require high-speed and low-power SRAM memory for storing and accessing data quickly. Its compact size and low power consumption make it ideal for use in various embedded systems and electronic devices.
Package

The IS61NLP102436B-200B3LI chip is available in a 119-ball BGA package. It comes in a 13.5mm x 13.5mm x 1.4mm form factor and has a size of 1024M x 36 bits.