ON DFB2560
Bridge Rectifier Single Phase Standard 600 V Through Hole TS-6P
DFB2560 일반적인 설명
Bridge Rectifier Single Phase Standard 600 V Through Hole TS-6P
특징
- UL Certificate # E258596
- Glass-Passivated Junction
- Ideal for Printed Circuit Board
- Reliable Low-Cost Construction
- Plastic Material has Underwriters Laboratory Flammability Classification 94V-0
- Surge Overload Rating: 350 A Peak
- High Case Dielectric Strength: 2500 VRMS
- Isolated Voltage from Case to Lead: > 2500 V
애플리케이션
- This product is general usage and suitable for many different applications.
명세서
매개변수 | 값 | 매개변수 | 값 |
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Source Content uid | DFB2560 | Pbfree Code | Yes |
Part Life Cycle Code | Not Recommended | Ihs Manufacturer | ONSEMI |
Package Description | TS-6P, 4 PIN | Manufacturer Package Code | 127EP |
Reach Compliance Code | not_compliant | ECCN Code | EAR99 |
HTS Code | 8541.10.00.80 | Factory Lead Time | 4 Weeks |
Samacsys Manufacturer | onsemi | Additional Feature | UL RECOGNIZED |
Case Connection | ISOLATED | Configuration | BRIDGE, 4 ELEMENTS |
Diode Element Material | SILICON | Diode Type | BRIDGE RECTIFIER DIODE |
JESD-30 Code | R-PSFM-T4 | Number of Elements | 4 |
Number of Phases | 1 | Number of Terminals | 4 |
Package Body Material | PLASTIC/EPOXY | Package Shape | RECTANGULAR |
Package Style | FLANGE MOUNT | Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Surface Mount | NO | Terminal Finish | Matte Tin (Sn) - annealed |
Terminal Form | THROUGH-HOLE | Terminal Position | SINGLE |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | feature-bridge-type | Single Phase |
feature-diode-type | feature-configuration | Single | |
feature-peak-reverse-repetitive-voltage-v | 600 | feature-peak-average-forward-current-a | 25 |
feature-peak-rms-reverse-voltage-v | 420 | feature-peak-non-repetitive-forward-surge-current-a | 350 |
feature-peak-forward-voltage-v | 1.1 | feature-peak-reverse-current-ua | 10 |
feature-maximum-power-dissipation-mw | feature-peak-reverse-recovery-time-ns | ||
feature-packaging | Rail | feature-pin-count | 4 |
feature-supplier-package | SIP | feature-standard-package-name1 | SIP |
feature-cecc-qualified | No | feature-esd-protection | |
feature-military | No | feature-aec-qualified | No |
feature-auto-motive | No | feature-p-pap | No |
feature-eccn-code | EAR99 | feature-svhc | Yes |
feature-svhc-exceeds-threshold | Yes |
배송
배송 유형 | 배송비 | 리드타임 | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 날 | |
페덱스 | $20.00-$40.00 (0.50 KG) | 2-5 날 | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 날 | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 날 | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 날 | |
등기 항공 우편 | $20.00-$40.00 (0.50 KG) | 2-5 날 |
처리 시간: 배송비는 지역 및 국가에 따라 다릅니다.
지불
지불 조건 | 핸드 수수료 | |
---|---|---|
은행 송금 | US$30.00의 은행 수수료를 부과합니다. | |
페이팔 | 4.0%의 서비스 수수료를 부과합니다. | |
신용 카드 | 3.5% 서비스 수수료를 부과합니다. | |
웨스턴 유니언 | charge US.00 banking fee. | |
돈 그램 | US$0.00의 은행 수수료를 부과합니다. |
보증
1. 귀하가 구입한 전자 부품에는 365일 보증이 포함되어 있으며, 우리는 제품 품질을 보장합니다.
2. 귀하가 받은 품목 중 일부가 완벽한 품질이 아닌 경우, 당사는 책임 있게 귀하의 환불 또는 교체를 준비할 것입니다. 그러나 품목은 원래 상태를 유지해야 합니다.
포장
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단계1 :제품
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단계2 :진공 포장
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단계3 :정전기 방지 가방
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단계4 :개별 포장
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단계5 :포장 상자
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단계6 :바코드 배송 태그
모든 제품은 정전기 방지 가방에 포장됩니다. ESD 정전기 방지 보호 장치와 함께 배송됩니다.
외부 ESD 포장 라벨은 당사 정보(부품 번호, 브랜드 및 수량)를 사용합니다.
우리는 선적 전에 모든 상품을 검사하고, 모든 제품이 양호한 상태인지 확인하고, 부품이 새로운 원본 일치 데이터시트인지 확인합니다.
모든 상품을 포장한 후 문제가 없는지 확인한 후 안전하게 포장하여 글로벌 특급으로 보내드립니다. 우수한 밀봉 무결성과 함께 탁월한 천공 및 인열 저항성을 나타냅니다.
부품 포인트
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The DFB2560 chip is a digital filter baseband processor designed by Broadcom. It is commonly used in applications such as wireless communication systems, including Wi-Fi and Bluetooth. The chip includes advanced features like high-speed data processing, flexible filtering capabilities, and low power consumption. It is an essential component in many modern electronic devices that require efficient digital signal processing for better performance and connectivity.
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Equivalent
The equivalent products of the DFB2560 chip include the PIC32MX575F512H and PIC32MZ2048ECG100 chips manufactured by Microchip Technology. These chips offer similar functionalities and capabilities as the DFB2560 chip. -
Features
The DFB2560 (Digital Frequency Boost) is a digital signal processing technology that enhances audio quality by boosting specific frequency ranges. It provides dynamic range control, loudness compensation, and noise reduction features. The DFB2560 is often used in audio systems to improve sound clarity and accuracy. -
Pinout
DFB2560 is a microcontroller with 256 pins. The pin count refers to the number of physical connections available for communication with external devices. The function of each pin can vary, but typically includes input/output for data, power, ground, and control signals. -
Application Field
The DFB2560 is commonly used in applications such as optical communications, high-speed digital systems, wireless infrastructure, and test and measurement equipment. It is specifically designed for these areas due to its high bandwidth, low noise, and excellent linearity characteristics. -
Package
The DFB2560 chip is in a standard BGA (Ball Grid Array) package, which is commonly used for integrated circuit ICs. The form factor is rectangular, and the dimensions are 25mm x 25mm, making it a compact-sized chip.
데이터 시트 PDF
우리는 고품질 제품, 사려 깊은 서비스 및 판매 후 보증을 제공합니다.
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우리는 풍부한 제품을 보유하고 있으며 귀하의 다양한 요구를 충족시킬 수 있습니다.
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최소 주문 수량은 1개부터입니다.
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최저 국제 배송비는 $0.00부터 시작됩니다
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모든 제품에 대해 365일 품질 보증
Sufficient, but not without its flaws.