BSM30GP60
24-Pin ECONO2-5 Package
브랜드: Infineon
제조업체부품 #: BSM30GP60
데이터 시트: BSM30GP60 데이터 시트 (PDF)
패키지/케이스: EconoPIM2
RoHS 상태:
재고상태: 7908 PC, 새로운 원본
상품 유형: IGBT Modules
Warranty: 1 Year Ovaga Warranty - Find Out More
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*모든 가격은 USD 단위입니다.
수량 | 단가 | 추가 가격 |
---|---|---|
1 | $235.592 | $235.592 |
200 | $91.171 | $18234.200 |
500 | $87.967 | $43983.500 |
1000 | $86.384 | $86384.000 |
In Stock:7908 PCS
BSM30GP60 일반적인 설명
The BSM30GP60 is a power module designed for use in motor control applications. It is part of the SEMIKRON MiniSKiiP product family and features a half-bridge topology with an integrated IGBT and diode. The module has a voltage rating of 600V, a current rating of 30A, and a nominal power dissipation of 168W.The BSM30GP60 module is compact in size, measuring just 62mm x 30mm x 7mm, and is designed for easy integration into motor control systems. It offers low losses and high efficiency, making it ideal for applications where energy efficiency is a priority. The module is also designed for high reliability, with features such as overcurrent protection, short-circuit protection, and temperature monitoring to ensure safe and reliable operation.In terms of electrical characteristics, the BSM30GP60 module has a typical saturation voltage of 1.8V at a current of 30A and a typical threshold voltage of 2.3V. The module has a maximum junction temperature of 150°C and a maximum storage temperature of -40°C to 125°C.
특징
- BSM30GP60 is a 600V, 30A IGBT power module
- It features low stray inductance and low thermal resistance
- The module includes a NTC temperature sensor for over-temperature protection
- High short-circuit capability and low VCE(sat)
- Designed for high-frequency operation in hard switching applications
애플리케이션
- Industrial motor drives
- Wind power converters
- Solar inverters
- UPS systems
- Induction heating equipment
- Switching power supplies
- Welding equipment
- Automotive applications
- Medical equipment
- Telecommunication systems
명세서
매개변수 | 값 | 매개변수 | 값 |
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Product Category | IGBT Modules | RoHS | Details |
Product | IGBT Silicon Modules | Configuration | Hex |
Collector- Emitter Voltage VCEO Max | 600 V | Collector-Emitter Saturation Voltage | 2.45 V |
Continuous Collector Current at 25 C | 50 A | Gate-Emitter Leakage Current | 300 nA |
Pd - Power Dissipation | 180 W | Package / Case | EconoPIM2 |
Minimum Operating Temperature | - 40 C | Maximum Operating Temperature | + 125 C |
Brand | Infineon Technologies | Height | 17 mm |
Length | 107.5 mm | Maximum Gate Emitter Voltage | 20 V |
Mounting Style | Chassis Mount | Product Type | IGBT Modules |
Factory Pack Quantity | 10 | Subcategory | IGBTs |
Technology | Si | Width | 45 mm |
Part # Aliases | SP000100378 BSM30GP60BOSA1 |
배송
배송 유형 | 배송비 | 리드타임 | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 날 | |
페덱스 | $20.00-$40.00 (0.50 KG) | 2-5 날 | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 날 | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 날 | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 날 | |
등기 항공 우편 | $20.00-$40.00 (0.50 KG) | 2-5 날 |
처리 시간: 배송비는 지역 및 국가에 따라 다릅니다.
지불
지불 조건 | 핸드 수수료 | |
---|---|---|
은행 송금 | US$30.00의 은행 수수료를 부과합니다. | |
페이팔 | 4.0%의 서비스 수수료를 부과합니다. | |
신용 카드 | 3.5% 서비스 수수료를 부과합니다. | |
웨스턴 유니언 | charge US.00 banking fee. | |
돈 그램 | US$0.00의 은행 수수료를 부과합니다. |
보증
1. 귀하가 구입한 전자 부품에는 365일 보증이 포함되어 있으며, 우리는 제품 품질을 보장합니다.
2. 귀하가 받은 품목 중 일부가 완벽한 품질이 아닌 경우, 당사는 책임 있게 귀하의 환불 또는 교체를 준비할 것입니다. 그러나 품목은 원래 상태를 유지해야 합니다.
포장
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단계1 :제품
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단계2 :진공 포장
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단계3 :정전기 방지 가방
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단계4 :개별 포장
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단계5 :포장 상자
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단계6 :바코드 배송 태그
모든 제품은 정전기 방지 가방에 포장됩니다. ESD 정전기 방지 보호 장치와 함께 배송됩니다.
외부 ESD 포장 라벨은 당사 정보(부품 번호, 브랜드 및 수량)를 사용합니다.
우리는 선적 전에 모든 상품을 검사하고, 모든 제품이 양호한 상태인지 확인하고, 부품이 새로운 원본 일치 데이터시트인지 확인합니다.
모든 상품을 포장한 후 문제가 없는지 확인한 후 안전하게 포장하여 글로벌 특급으로 보내드립니다. 우수한 밀봉 무결성과 함께 탁월한 천공 및 인열 저항성을 나타냅니다.
부품 포인트
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The BSM30GP60 is a power module chip designed for use in various high-frequency switching applications. It integrates multiple power components into a single package, providing enhanced performance, efficiency, and reliability. The chip features low switching losses and high current capabilities, making it ideal for motor drives, renewable energy systems, and other power electronics applications.
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Equivalent
The equivalent products of the BSM30GP60 chip include BSM15GD120DN2, BSM15GP120DN2, BSM50GD120DN2, and BSM50GP120DN2. -
Features
BSM30GP60 is a 600V, 30A IGBT Power Module with integrated thermal sensor. It has low conduction and switching losses, high ruggedness and reliability, and compact size for easy mounting and replacement. It offers excellent thermal performance and high efficiency in various power electronic applications. -
Pinout
The BSM30GP60 is a 30 amp, 600 volt IGBT module with 7 pins. Pin functions include gate, emitter, collector, positive and negative terminals, and two auxiliary pins. -
Manufacturer
Infineon Technologies is the manufacturer of the BSM30GP60. Infineon Technologies is a German semiconductor company that produces various types of semiconductor products, including power modules like the BSM30GP60. The company focuses on providing solutions for various industries, such as automotive, industrial, and power management. -
Application Field
The BSM30GP60 is a high voltage insulated gate bipolar transistor (IGBT) used in power electronic applications such as motor drives, inverters, and converters. Its low on-state voltage drop and high switching speed make it suitable for high power density applications requiring efficient and reliable power switching. -
Package
The BSM30GP60 chip is typically packaged in a module form known as a Power Module. It usually comes in a standard size of around 30 x 50 mm. The chip itself is a IGBT (Insulated Gate Bipolar Transistor) and has a current rating of 30A and 600V.
우리는 고품질 제품, 사려 깊은 서비스 및 판매 후 보증을 제공합니다.
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우리는 풍부한 제품을 보유하고 있으며 귀하의 다양한 요구를 충족시킬 수 있습니다.
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최소 주문 수량은 1개부터입니다.
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최저 국제 배송비는 $0.00부터 시작됩니다
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모든 제품에 대해 365일 품질 보증