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TI WL1835MODGBMOCR

Name: WL1835MODGBMOCR
Rating: 4.5 (10 reviews)

Bluetooth, WiFi 802.11b/g/n, Bluetooth 4.2 Transceiver Module 2.4GHz Surface Mount

브랜드: TI

제조업체부품 #: WL1835MODGBMOCR

데이터 시트: WL1835MODGBMOCR 데이터 시트 (PDF)

패키지/케이스: SMD

상품 유형: RF Transceiver Modules

RoHS 상태:

재고상태: 600 PC, 새로운 원본

Warranty: 1 Year Ovaga Warranty - Find Out More

BOM에 추가

빠른 견적

다음에 대한 RFQ를 제출해 주십시오. WL1835MODGBMOCR 또는 우리에게 이메일을 보내: 이메일: [email protected], 12시간 이내에 연락드리겠습니다.

수량^*

이메일^*

담당자 이름^*

회사

주목

WL1835MODGBMOCR 일반적인 설명

The certified WiLink™ 8 module from TI offers high throughput and extended range along with Wi-Fi^® and Bluetooth^® coexistence (WL1835MOD only) in a power-optimized design. The WL18x5MOD device is a 2.4-GHz module, two antenna solution. The device is FCC, IC, ETSI/CE, and TELEC certified for AP and client. TI offers drivers for high-level operating systems such as Linux and Android™. Additional drivers, such as WinCE and RTOS, which includes QNX, Nucleus, ThreadX, and FreeRTOS, are supported through third parties.

특징

General
- Integrates RF, power amplifiers (PAs), clock, RF switches, filters, passives, and power management
- Quick hardware design with TI module collateral and reference designs
- Operating temperature: –20°C to +70°C
- Small form factor: 13.3 × 13.4 × 2 mm
- 100-pin MOC package
- FCC, IC, ETSI/CE, and TELEC certified with PCB, dipole, chip, and PIFA antennas
Wi-Fi
- WLAN baseband processor and RF transceiver support of IEEE Std 802.11b, 802.11g, and 802.11n
- 20- and 40-MHz SISO and 20-MHz 2 × 2 MIMO at 2.4 GHz for high throughput: 80 Mbps (TCP), 100 Mbps (UDP)
- 2.4-GHz MRC support for extended range
- Fully calibrated: production calibration not required
- 4-bit SDIO host interface support
- Wi-Fi direct concurrent operation (multichannel, multirole)
Bluetooth and Bluetooth low energy (WL183xMOD only)
- Bluetooth 5.1 secure connection compliant and CSA2 support (declaration ID: D032799)
- Host controller interface (HCI) transport for Bluetooth over UART
- Dedicated audio processor support of SBC encoding + A2DP
- Dual-mode Bluetooth and Bluetooth low energy
- TI’s Bluetooth and Bluetooth low energy certified stack
Key benefits
- Reduces design overhead
- Differentiated use cases by configuring WiLink™ 8 simultaneously in two roles (STA and AP) to connect directly with other Wi-Fi devices on different RF channel (Wi-Fi networks)
- Best-in-class Wi-Fi with high-performance audio and video streaming reference applications with up to 1.4× the range versus one antenna
- Different provisioning methods for in-home devices connectivity to Wi-Fi in one step
- Lowest Wi-Fi power consumption in connected idle (< 800 µA)
- Configurable wake on WLAN filters to only wake up the system
- Wi-Fi and Bluetooth single antenna coexistence

명세서

매개변수	값	매개변수	값
Processor	External MPU	Type	Module, Transceiver
Protocols	Combo (Wi-Fi + Bluetooth), Wi-Fi 2.4 GHz	Throughput (max) (MBits)	100
Security	Networking security (WPA3)	Features	2x2 MIMO, 802.11bgn, AP, Bluetooth, Bluetooth low energy, COEX, STA, Wi-Fi direct mode
Certifications	CE, FCC, ISED, MIC	Operating temperature range (°C)	-20 to 70
Rating	Catalog

배송

	배송비	리드타임
DHL	$20.00-$40.00 (0.50 KG)	2-5 날
페덱스	$20.00-$40.00 (0.50 KG)	2-5 날
UPS	$20.00-$40.00 (0.50 KG)	2-5 날
TNT	$20.00-$40.00 (0.50 KG)	2-5 날
EMS	$20.00-$40.00 (0.50 KG)	2-5 날
등기 항공 우편	$20.00-$40.00 (0.50 KG)	2-5 날

처리 시간: 배송비는 지역 및 국가에 따라 다릅니다.

지불

지불 조건		핸드 수수료
	은행 송금	US$30.00의 은행 수수료를 부과합니다.
	페이팔	4.0%의 서비스 수수료를 부과합니다.
	신용 카드	3.5% 서비스 수수료를 부과합니다.
	웨스턴 유니언	charge US.00 banking fee.
	돈 그램	US$0.00의 은행 수수료를 부과합니다.

보증

1. 귀하가 구입한 전자 부품에는 365일 보증이 포함되어 있으며, 우리는 제품 품질을 보장합니다.

2. 귀하가 받은 품목 중 일부가 완벽한 품질이 아닌 경우, 당사는 책임 있게 귀하의 환불 또는 교체를 준비할 것입니다. 그러나 품목은 원래 상태를 유지해야 합니다.

포장

단계1 :제품
단계2 :진공 포장
단계3 :정전기 방지 가방
단계4 :개별 포장
단계5 :포장 상자
단계6 :바코드 배송 태그

모든 제품은 정전기 방지 가방에 포장됩니다. ESD 정전기 방지 보호 장치와 함께 배송됩니다.

외부 ESD 포장 라벨은 당사 정보(부품 번호, 브랜드 및 수량)를 사용합니다.

우리는 선적 전에 모든 상품을 검사하고, 모든 제품이 양호한 상태인지 확인하고, 부품이 새로운 원본 일치 데이터시트인지 확인합니다.

모든 상품을 포장한 후 문제가 없는지 확인한 후 안전하게 포장하여 글로벌 특급으로 보내드립니다. 우수한 밀봉 무결성과 함께 탁월한 천공 및 인열 저항성을 나타냅니다.

부품 포인트

The WL1835MODGBMOCR chip is a wireless connectivity module developed by Texas Instruments. It is designed for embedded applications requiring Wi-Fi and Bluetooth connectivity. The chip integrates a Wi-Fi transceiver and a Bluetooth transceiver, enabling devices to communicate wirelessly with other devices or networks. It offers high-performance Wi-Fi and Bluetooth functionality in a compact form factor, making it ideal for various IoT and smart home applications.
Equivalent

There are no direct equivalent products of the WL1835MODGBMOCR chip. However, similar alternatives include the ESP32 and nRF52840, which offer similar functionalities and features for wireless communication and IoT applications.
Features

The WL1835MODGBMOCR is a Wi-Fi and Bluetooth module by Texas Instruments. Its features include support for 2.4 and 5 GHz bands, Wi-Fi Direct and Soft AP modes, Bluetooth Low Energy (BLE) connectivity, and Bluetooth Classic support. It also offers integrated power management and enhanced security capabilities.
Pinout

The pin count of the WL1835MODGBMOCR module is 88. It is a wireless network module that integrates Wi-Fi, Bluetooth, and Bluetooth Low Energy (BLE) functionalities.
Manufacturer

The manufacturer of the WL1835MODGBMOCR is Texas Instruments. It is an American technology company that specializes in designing and manufacturing semiconductors and various integrated circuits.
Application Field

The WL1835MODGBMOCR is a wireless connectivity module typically used in applications such as home automation, industrial automation, smart grids, healthcare, and asset tracking. It enables wireless communication over Bluetooth and Wi-Fi, making it suitable for various IoT devices requiring connectivity and data transfer capabilities.
Package

The WL1835MODGBMOCR chip has a Ball Grid Array (BGA) package type, with a form factor of 7.5mm x 7.5mm.