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TI WL1807MODGIMOCR

Name: WL1807MODGIMOCR
Rating: 4.5 (10 reviews)

Multiprotocol Modules WL18xxMOD Dual-Band Ind Mod

브랜드: Ti

제조업체부품 #: WL1807MODGIMOCR

데이터 시트: WL1807MODGIMOCR 데이터 시트 (PDF)

패키지/케이스: QFM100

상품 유형: Combo Wireless Module

RoHS 상태:

재고상태: 1115 PC, 새로운 원본

Warranty: 1 Year Ovaga Warranty - Find Out More

BOM에 추가

빠른 견적

다음에 대한 RFQ를 제출해 주십시오. WL1807MODGIMOCR 또는 우리에게 이메일을 보내: 이메일: [email protected], 12시간 이내에 연락드리겠습니다.

수량^*

이메일^*

담당자 이름^*

회사

주목

WL1807MODGIMOCR 일반적인 설명

The certified WiLink™ 8 module from TI offers high throughput and extended range along with Wi-Fi^® and Bluetooth^® coexistence (WL1837MOD only) in a power-optimized design. The WL18x7MOD is a Wi-Fi, dual-band, 2.4- and 5-GHz module solution with two antennas supporting industrial temperature grade. The device is FCC, IC, ETSI/CE, and TELEC certified for AP (with DFS support) and client. TI offers drivers for high-level operating systems, such as Linux and Android™. Additional drivers, such as WinCE and RTOS, which includes QNX, Nucleus, ThreadX, and FreeRTOS, are supported through third parties.

특징

General
- Integrates RF, power amplifiers (PAs), clock, RF switches, filters, passives, and power management
- Quick hardware design with TI module collateral and reference designs
- Operating temperature: –40°C to +85°C industrial temperature grade
- Small form factor: 13.3 × 13.4 × 2 mm
- 100-pin MOC package
- FCC, IC, ETSI/CE, and TELEC certified with PCB, dipole, chip, and PIFA antennas
Wi-Fi
- WLAN baseband processor and RF transceiver support of IEEE Std 802.11a, 802.11b, 802.11g, and 802.11n
- 20- and 40-MHz SISO and 20-MHz 2 × 2 MIMO at 2.4 GHz for high throughput: 80 Mbps (TCP), 100 Mbps (UDP)
- 2.4-GHz MRC support for extended range and 5-GHz diversity capable
- Fully calibrated: production calibration not required
- 4-bit SDIO host interface support
- Wi-Fi direct concurrent operation (multichannel, multirole)
Bluetooth and Bluetooth low energy ( WL1837MOD only)
- Bluetooth 5.1 secure connection compliant and CSA2 support (declaration ID: D052427 )
- Host controller interface (HCI) transport for Bluetooth over UART
- Dedicated audio processor support of SBC encoding + A2DP
- Dual-mode Bluetooth and Bluetooth low energy
- TI’s Bluetooth and Bluetooth low energy certified stack
Key benefits
- Reduces design overhead
- Differentiated use cases by configuring WiLink™ 8 simultaneously in two roles (STA and AP) to connect directly with other Wi-Fi devices on different RF channel (Wi-Fi networks)
- Best-in-class Wi-Fi with high-performance audio and video streaming reference applications with up to 1.4× the range versus one antenna
- Different provisioning methods for in-home devices connectivity to Wi-Fi in one step
- Lowest Wi-Fi power consumption in connected idle (< 800 µA)
- Configurable wake on WLAN filters to only wake up the system
- Wi-Fi and Bluetooth single antenna coexistence

명세서

매개변수	값	매개변수	값
Processor	External MPU	Type	Module, Transceiver
Protocols	Wi-Fi 2.4 GHz, Wi-Fi 5 GHz	Throughput (max) (MBits)	100
Security	Networking security (WPA3)	Features	2x2 MIMO, 802.11abgn, AP, Mesh over Wi-Fi based on 802.11s, STA, Wi-Fi direct mode
Certifications	CE, FCC, ISED, MIC	Operating temperature range (°C)	-40 to 85
Rating	Catalog

배송

	배송비	리드타임
DHL	$20.00-$40.00 (0.50 KG)	2-5 날
페덱스	$20.00-$40.00 (0.50 KG)	2-5 날
UPS	$20.00-$40.00 (0.50 KG)	2-5 날
TNT	$20.00-$40.00 (0.50 KG)	2-5 날
EMS	$20.00-$40.00 (0.50 KG)	2-5 날
등기 항공 우편	$20.00-$40.00 (0.50 KG)	2-5 날

처리 시간: 배송비는 지역 및 국가에 따라 다릅니다.

지불

지불 조건		핸드 수수료
	은행 송금	US$30.00의 은행 수수료를 부과합니다.
	페이팔	4.0%의 서비스 수수료를 부과합니다.
	신용 카드	3.5% 서비스 수수료를 부과합니다.
	웨스턴 유니언	charge US.00 banking fee.
	돈 그램	US$0.00의 은행 수수료를 부과합니다.

보증

1. 귀하가 구입한 전자 부품에는 365일 보증이 포함되어 있으며, 우리는 제품 품질을 보장합니다.

2. 귀하가 받은 품목 중 일부가 완벽한 품질이 아닌 경우, 당사는 책임 있게 귀하의 환불 또는 교체를 준비할 것입니다. 그러나 품목은 원래 상태를 유지해야 합니다.

포장

단계1 :제품
단계2 :진공 포장
단계3 :정전기 방지 가방
단계4 :개별 포장
단계5 :포장 상자
단계6 :바코드 배송 태그

모든 제품은 정전기 방지 가방에 포장됩니다. ESD 정전기 방지 보호 장치와 함께 배송됩니다.

외부 ESD 포장 라벨은 당사 정보(부품 번호, 브랜드 및 수량)를 사용합니다.

우리는 선적 전에 모든 상품을 검사하고, 모든 제품이 양호한 상태인지 확인하고, 부품이 새로운 원본 일치 데이터시트인지 확인합니다.

모든 상품을 포장한 후 문제가 없는지 확인한 후 안전하게 포장하여 글로벌 특급으로 보내드립니다. 우수한 밀봉 무결성과 함께 탁월한 천공 및 인열 저항성을 나타냅니다.

부품 포인트

The WL1807MODGIMOCR chip is a highly integrated wireless communication module. It supports Wi-Fi, Bluetooth, and Bluetooth Low Energy (BLE) connectivity. It's commonly used in IoT devices, smart home applications, and industrial automation. With its compact design and versatile features, it provides reliable wireless connectivity for various applications.
Equivalent

The WL1807MODGIMOCR chip's equivalent products include the WL1801MODGIMOCR, WL1831MODGIMOCR, and WL1835MODGIMOCR. They are all part of the same WiLink™ 8 family from Texas Instruments, offering similar features and functionalities for wireless connectivity in IoT and embedded systems.
Features

WL1807MODGIMOCR is an integrated dual-band Wi-Fi and Bluetooth module that supports 2x2 MIMO technology and includes an additional on-chip processor for offloading some host CPU tasks. It also features support for Bluetooth Low Energy (BLE) v4.2 and Zigbee, as well as dual-mode wideband RF transceivers.
Pinout

The WL1807MODGIMOCR is a wireless module with 180 pins. It integrates Wi-Fi, Bluetooth, and FM functionalities, suitable for embedded systems requiring wireless connectivity. The pin functions include power, communication interfaces, and antenna connections.
Manufacturer

The WL1807MODGIMOCR is manufactured by Texas Instruments (TI), an American semiconductor company. TI specializes in designing and manufacturing semiconductors and integrated circuits for a wide range of applications, including analog and digital electronics, embedded systems, and wireless connectivity solutions like the WL1807MODGIMOCR.
Application Field

The WL1807MODGIMOCR is primarily used in Internet of Things (IoT) applications, including smart homes, industrial automation, healthcare monitoring, and wearable devices. It enables wireless connectivity, location tracking, and communication capabilities in compact and power-efficient devices.
Package

The WL1807MODGIMOCR chip comes in a BGA (Ball Grid Array) package type, with a form factor of module, and its size is approximately 6.5mm x 6.5mm.