MOC3023

부품 포인트

• The MOC3023 chip is an optoisolator that consists of a phototransistor and a gallium arsenide infrared-emitting diode. It is widely used in optically isolated triac driver circuits. The chip helps in controlling AC voltage through a triac by providing electrical isolation between the input and output sections, making it suitable for applications in dimmer switches, motor control circuits, and other solid-state relays.

• Equivalent

  Equivalent products of the MOC3023 chip include the PC817, FOD817, TLP181, and EL817. These devices are also optocouplers with similar features and functions for applications like driving triacs or solid-state relays.

• Features

  MOC3023 is an optoisolator consisting of a phototriac and input LED. It is designed to control AC loads and provide isolation between high and low voltage circuits. It features a high input sensitivity, low trigger currents, and offers excellent noise immunity. The device exhibits high switching speed and is suitable for a wide range of applications.

• Pinout

  The MOC3023 is an optoisolator with a zero-crossing TRIAC driver output. It has a 6-pin DIP package. The pins include anode, cathode, and bypass for the LED, and MT1, MT2, and gate for the TRIAC output.

• Manufacturer

  The manufacturer of the MOC3023 is ON Semiconductor. ON Semiconductor is a global supplier of semiconductor-based solutions, providing a range of components for various industries, including power and energy management, automotive, and communications.

• Application Field

  The MOC3023 is commonly used in applications that require electrical isolation and control of AC loads, such as in industrial automation, motor controls, solid-state relays, lighting controls, and power supplies. Its main function is to provide isolation and deliver control signals to the output triac, allowing for precise switching and control of AC loads.

• Package

  The MOC3023 chip is offered in a package type known as DIP-6. DIP stands for Dual in-line package, which is a common type of packaging for integrated circuits. The chip has 6 pins (leads) arranged in a straight line. Exact dimensions can vary, but typically the DIP-6 package measures around 0.45 inches (11.4 mm) in length and 0.2 inches (5.08 mm) in width.