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주문 금액이

$5000
받으세요 $50 할인을 !

LPC1754FBD80,518 48HRS

80-Pin LQFP Package

ISO14001 ISO9001 DUNS

브랜드: NXP SEMICONDUCTORS

제조업체부품 #: LPC1754FBD80,518

데이터 시트: LPC1754FBD80,518 데이터 시트 (PDF)

패키지/케이스: LQFP-80

RoHS 상태:

재고상태: 5,792 PC, 새로운 원본

상품 유형: Microcontrollers

Warranty: 1 Year Ovaga Warranty - Find Out More

가격

*모든 가격은 USD 단위입니다.

수량 단가 추가 가격
1 $9.232 $9.232
10 $8.098 $80.980
30 $7.408 $222.240
100 $6.828 $682.800

재고: 5,792 PCS

- +

빠른 견적

다음에 대한 RFQ를 제출해 주십시오. LPC1754FBD80,518 또는 우리에게 이메일을 보내: 이메일: [email protected], 12시간 이내에 연락드리겠습니다.

LPC1754FBD80,518 일반적인 설명

Embedded developers will find the LPC1754FBD80,518 microcontroller to be a versatile platform for a multitude of communication interfaces, including UART, SPI, I2C, and CAN, as well as USB connectivity. This broad spectrum of communication options enables seamless integration with a variety of peripheral devices and networks. Additionally, the microcontroller's abundant timers, PWM channels, analog peripherals, and GPIO pins afford ample flexibility for interfacing with sensors, actuators, and other external hardware components

특징

  • ARM Cortex-M3 processor, running at frequencies of up to 100 MHz
  • (LPC1758/56/57/54/52/51) or of up to 120 MHz (LPC1759). A Memory Protection Unit
  • (MPU) supporting eight regions is included.
  • ARM Cortex-M3 built-in Nested Vectored Interrupt Controller (NVIC).
  • Up to 512 kB on-chip flash programming memory. Enhanced flash memory accelerator enables high-speed 120 MHz operation with zero wait states.
  • In-System Programming (ISP) and In-Application Programming (IAP) via on-chip bootloader software.
  • On-chip SRAM includes:
  • ♦ Up to 32 kB of SRAM on the CPU with local code/data bus for high-performance CPU access.
  • ♦ Two/one 16 kB SRAM blocks with separate access paths for higher throughput.
  • These SRAM blocks may be used for Ethernet (LPC1758 only), USB, and DMA memory, as well as for general purpose CPU instruction and data storage.
  • Eight channel General Purpose DMA controller (GPDMA) on the AHB multilayer matrix that can be used with the SSP, I2S-bus, UART, the Analog-to-Digital and Digital-to-Analog converter peripherals, timer match signals, and for memory-to-memory transfers.
  • Multilayer AHB matrix interconnect provides a separate bus for each AHB master. AHB masters include the CPU, General Purpose DMA controller, Ethernet MAC (LPC1758 only), and the USB interface. This interconnect provides communication with no arbitration delays.
  •  Split APB bus allows high throughput with few stalls between the CPU and DMA.
  • Serial interfaces:
  •  ♦ On the LPC1758 only, Ethernet MAC with RMII interface and dedicated DMA controller.
  •  ♦ USB 2.0 full-speed device/Host/OTG controller with dedicated DMA controller and on-chip PHY for device, Host, and OTG functions. The LPC1752/51 include a USB device controller only.
  •  ♦ Four UARTs with fractional baud rate generation, internal FIFO, and DMA support. One UART has modem control I/O and RS-485/EIA-485 support, and one UART has IrDA support.
  •  ♦ CAN 2.0B controller with two (LPC1759/58/56) or one (LPC1754/52/51) channels.
  •  ♦ SPI controller with synchronous, serial, full duplex communication and programmable data length.
  •  ♦ Two SSP controllers with FIFO and multi-protocol capabilities. The SSP interfaces can be used with the GPDMA controller.
  •  ♦ Two I2C-bus interfaces supporting fast mode with a data rate of 400 kbit/s with multiple address recognition and monitor mode.
  •  ♦ On the LPC1759/58/56 only, I2S (Inter-IC Sound) interface for digital audio input or output, with fractional rate control. The I2S-bus interface can be used with the GPDMA. The I2S-bus interface supports 3-wire and 4-wire data transmit and receive as well as master clock input/output.
  • Other peripherals:
  •  ♦ 52 General Purpose I/O (GPIO) pins with configurable pull-up/down resistors. All GPIOs support a new, configurable open-drain operating mode. The GPIO block is accessed through the AHB multilayer bus for fast access and located in memory such that it supports Cortex-M3 bit banding and use by the General Purpose DMA Controller.
  •  ♦ 12-bit Analog-to-Digital Converter (ADC) with input multiplexing among six pins, conversion rates up to 200 kHz, and multiple result registers. The 12-bit ADC can be used with the GPDMA controller.
  •  ♦ On the LPC1759/58/56/54 only, 10-bit Digital-to-Analog Converter (DAC) with dedicated conversion timer and DMA support.
  •  Four general purpose timers/counters, with a total of three capture inputs and ten compare outputs. Each timer block has an external count input. Specific timer events can be selected to generate DMA requests.
  •  ♦ One motor control PWM with support for three-phase motor control.
  •  ♦ Quadrature encoder interface that can monitor one external quadrature encoder.
  •  ♦ One standard PWM/timer block with external count input.
  •  ♦ Real-Time Clock (RTC) with a separate power domain and dedicated RTC oscillator. The RTC block includes 20 bytes of battery-powered backup registers.
  •  ♦ WatchDog Timer (WDT). The WDT can be clocked from the internal RC oscillator, the RTC oscillator, or the APB clock.
  •  ♦ ARM Cortex-M3 system tick timer, including an external clock input option.
  •  ♦ Repetitive Interrupt Timer (RIT) provides programmable and repeating timed interrupts.
  • ♦ Each peripheral has its own clock divider for further power savings.

명세서

매개변수 매개변수
Source Content uid LPC1754FBD80,518 Rohs Code Yes
Part Life Cycle Code Active Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code QFP Package Description LFQFP, QFP80,.55SQ,20
Pin Count 80 Manufacturer Package Code SOT315-1
Reach Compliance Code compliant HTS Code 8542.31.00.01
Factory Lead Time 52 Weeks Samacsys Manufacturer NXP
Has ADC YES Address Bus Width
Bit Size 32 Clock Frequency-Max 25 MHz
DAC Channels NO DMA Channels YES
External Data Bus Width JESD-30 Code S-PQFP-G80
JESD-609 Code e3 Length 12 mm
Moisture Sensitivity Level 2 Number of I/O Lines 52
Number of Terminals 80 Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C PWM Channels YES
Package Body Material PLASTIC/EPOXY Package Code LFQFP
Package Equivalence Code QFP80,.55SQ,20 Package Shape SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH Peak Reflow Temperature (Cel) 260
Power Supplies 3.3 V Qualification Status Not Qualified
RAM (bytes) 32768 ROM (words) 131072
ROM Programmability FLASH Seated Height-Max 1.6 mm
Speed 100 MHz Supply Current-Max 100 mA
Supply Voltage-Max 3.6 V Supply Voltage-Min 2.4 V
Supply Voltage-Nom 3.3 V Surface Mount YES
Technology CMOS Temperature Grade INDUSTRIAL
Terminal Finish TIN Terminal Form GULL WING
Terminal Pitch 0.5 mm Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) 30 Width 12 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC Series LPC17xx
Product Status Active Programmabe Not Verified
Core Processor ARM® Cortex®-M3 Core Size 32-Bit Single-Core
Connectivity CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O 52 Program Memory Size 128KB (128K x 8)
Program Memory Type FLASH RAM Size 32K x 8
Voltage - Supply (Vcc/Vdd) 2.4V ~ 3.6V Data Converters A/D 6x12b; D/A 1x10b
Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount Package / Case 80-LQFP
Supplier Device Package 80-LQFP (12x12)

배송

배송 유형 배송비 리드타임
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 날
Fedex 페덱스 $20.00-$40.00 (0.50 KG) 2-5 날
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 날
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 날
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 날
등기 항공 우편 등기 항공 우편 $20.00-$40.00 (0.50 KG) 2-5 날

처리 시간: 배송비는 지역 및 국가에 따라 다릅니다.

지불

지불 조건 핸드 수수료
은행 송금 은행 송금 US$30.00의 은행 수수료를 부과합니다.
페이팔 페이팔 4.0%의 서비스 수수료를 부과합니다.
신용 카드 신용 카드 3.5% 서비스 수수료를 부과합니다.
웨스턴 유니언 웨스턴 유니언 charge US.00 banking fee.
돈 그램 돈 그램 US$0.00의 은행 수수료를 부과합니다.

보증

1. 귀하가 구입한 전자 부품에는 365일 보증이 포함되어 있으며, 우리는 제품 품질을 보장합니다.

2. 귀하가 받은 품목 중 일부가 완벽한 품질이 아닌 경우, 당사는 책임 있게 귀하의 환불 또는 교체를 준비할 것입니다. 그러나 품목은 원래 상태를 유지해야 합니다.

포장

  • 제품

    단계1 :제품

  • 진공 포장

    단계2 :진공 포장

  • 정전기 방지 가방

    단계3 :정전기 방지 가방

  • 개별 포장

    단계4 :개별 포장

  • 포장 상자

    단계5 :포장 상자

  • 바코드 배송 태그

    단계6 :바코드 배송 태그

모든 제품은 정전기 방지 가방에 포장됩니다. ESD 정전기 방지 보호 장치와 함께 배송됩니다.

외부 ESD 포장 라벨은 당사 정보(부품 번호, 브랜드 및 수량)를 사용합니다.

우리는 선적 전에 모든 상품을 검사하고, 모든 제품이 양호한 상태인지 확인하고, 부품이 새로운 원본 일치 데이터시트인지 확인합니다.

모든 상품을 포장한 후 문제가 없는지 확인한 후 안전하게 포장하여 글로벌 특급으로 보내드립니다. 우수한 밀봉 무결성과 함께 탁월한 천공 및 인열 저항성을 나타냅니다.

  • ESD
  • ESD

우리는 고품질 제품, 사려 깊은 서비스 및 판매 후 보증을 제공합니다.

  • 제품

    우리는 풍부한 제품을 보유하고 있으며 귀하의 다양한 요구를 충족시킬 수 있습니다.

  • quantity

    최소 주문 수량은 1개부터입니다.

  • shipping

    최저 국제 배송비는 $0.00부터 시작됩니다

  • 보장하다

    모든 제품에 대해 365일 품질 보증

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