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JS28F256P30BFE

Name: JS28F256P30BFE
Rating: 4.5 (10 reviews)

NOR Flash Parallel 256Mbit 16 56/56

브랜드: MICRON TECHNOLOGY INC

제조업체부품 #: JS28F256P30BFE

데이터 시트: JS28F256P30BFE 데이터 시트 (PDF)

패키지/케이스: TSOP-56

상품 유형: NOR Flash

RoHS 상태:

재고상태: 8166 PC, 새로운 원본

Warranty: 1 Year Ovaga Warranty - Find Out More

BOM에 추가

빠른 견적

다음에 대한 RFQ를 제출해 주십시오. JS28F256P30BFE 또는 우리에게 이메일을 보내: 이메일: [email protected], 12시간 이내에 연락드리겠습니다.

수량^*

이메일^*

담당자 이름^*

회사

주목

특징

High performance
— 85/88 ns initial access
— 40 MHz with zero wait states, 20 ns clock-to data output synchronous-burst read mode
— 25 ns asynchronous-page read mode
— 4-, 8-, 16-, and continuous-word burst mode
— Buffered Enhanced Factory Programming (BEFP) at 5 µs/byte (Typ)
— 1.8 V buffered programming at 7 µs/byte (Typ)
Architecture
— Multi-Level Cell Technology: Highest Density at Lowest Cost
— Asymmetrically-blocked architecture
— Four 32-KByte parameter blocks: top or bottom configuration
— 128-KByte main blocks
Voltage and Power
—VCC(core) voltage: 1.7 V – 2.0 V
—VCCQ (I/O) voltage: 1.7 V – 3.6 V
— Standby current: 55 µA (Typ) for 256-Mbit
— 4-Word synchronous read current: 13 mA (Typ) at 40 MHz
Quality and Reliability
— Operating temperature: –40 °C to +85 °C
1-Gbit in SCSP is –30 °C to +85 °C
— Minimum 100,000 erase cycles per block
— ETOX™ VIII process technology (130 nm)
Security
— One-Time Programmable Registers:
64 unique factory device identifier bits
64 user-programmable OTP bits
Additional 2048 user-programmable OTP bits
— Selectable OTP Space in Main Array:
4x32KB parameter blocks + 3x128KB main blocks (top or bottom configuration)
— Absolute write protection: VPP= VSS
— Power-transition erase/program lockout
— Individual zero-latency block locking
— Individual block lock-down
Software
— 20 µs (Typ) program suspend
— 20 µs (Typ) erase suspend
—Intel® Flash Data Integrator optimized
— Basic Command Set and Extended Command Set compatible
— Common Flash Interface capable
Density and Packaging
— 64/128/256-Mbit densities in 56-Lead TSOP package
— 64/128/256/512-Mbit densities in 64-Ball Intel®Easy BGA package
— 64/128/256/512-Mbit and 1-Gbit densities in Intel®QUAD+ SCSP
— 16-bit wide data bus

명세서

매개변수	값	매개변수	값
Pbfree Code	Yes	Rohs Code	Yes
Part Life Cycle Code	Obsolete	Ihs Manufacturer	MICRON TECHNOLOGY INC
Package Description	TSOP-56	Reach Compliance Code	compliant
ECCN Code	EAR99	HTS Code	8542.32.00.51
Samacsys Manufacturer	Micron	Access Time-Max	20 ns
Additional Feature	IT ALSO HAVE ASYNCHRONOUS OPERATING MODE	Boot Block	BOTTOM
Command User Interface	YES	Common Flash Interface	YES
Data Polling	NO	JESD-30 Code	R-PDSO-G56
JESD-609 Code	e3	Length	18.4 mm
Memory Density	268435456 bit	Memory IC Type	FLASH
Memory Width	16	Number of Functions	1
Number of Sectors/Size	4,255	Number of Terminals	56
Number of Words	16777216 words	Number of Words Code	16000000
Operating Mode	SYNCHRONOUS	Operating Temperature-Max	85 °C
Operating Temperature-Min	-40 °C	Organization	16MX16
Package Body Material	PLASTIC/EPOXY	Package Code	TSSOP
Package Equivalence Code	TSSOP56,.8,20	Package Shape	RECTANGULAR
Package Style	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	Parallel/Serial	PARALLEL
Programming Voltage	1.8 V	Qualification Status	Not Qualified
Seated Height-Max	1.025 mm	Sector Size	16K,64K
Standby Current-Max	0.00021 A	Supply Current-Max	0.031 mA
Supply Voltage-Max (Vsup)	2 V	Supply Voltage-Min (Vsup)	1.7 V
Supply Voltage-Nom (Vsup)	1.8 V	Surface Mount	YES
Technology	CMOS	Temperature Grade	INDUSTRIAL
Terminal Finish	MATTE TIN	Terminal Form	GULL WING
Terminal Pitch	0.5 mm	Terminal Position	DUAL
Toggle Bit	NO	Type	NOR TYPE
Width	14 mm

배송

	배송비	리드타임
DHL	$20.00-$40.00 (0.50 KG)	2-5 날
페덱스	$20.00-$40.00 (0.50 KG)	2-5 날
UPS	$20.00-$40.00 (0.50 KG)	2-5 날
TNT	$20.00-$40.00 (0.50 KG)	2-5 날
EMS	$20.00-$40.00 (0.50 KG)	2-5 날
등기 항공 우편	$20.00-$40.00 (0.50 KG)	2-5 날

처리 시간: 배송비는 지역 및 국가에 따라 다릅니다.

지불

지불 조건		핸드 수수료
	은행 송금	US$30.00의 은행 수수료를 부과합니다.
	페이팔	4.0%의 서비스 수수료를 부과합니다.
	신용 카드	3.5% 서비스 수수료를 부과합니다.
	웨스턴 유니언	charge US.00 banking fee.
	돈 그램	US$0.00의 은행 수수료를 부과합니다.

보증

1. 귀하가 구입한 전자 부품에는 365일 보증이 포함되어 있으며, 우리는 제품 품질을 보장합니다.

2. 귀하가 받은 품목 중 일부가 완벽한 품질이 아닌 경우, 당사는 책임 있게 귀하의 환불 또는 교체를 준비할 것입니다. 그러나 품목은 원래 상태를 유지해야 합니다.

포장

단계1 :제품
단계2 :진공 포장
단계3 :정전기 방지 가방
단계4 :개별 포장
단계5 :포장 상자
단계6 :바코드 배송 태그

모든 제품은 정전기 방지 가방에 포장됩니다. ESD 정전기 방지 보호 장치와 함께 배송됩니다.

외부 ESD 포장 라벨은 당사 정보(부품 번호, 브랜드 및 수량)를 사용합니다.

우리는 선적 전에 모든 상품을 검사하고, 모든 제품이 양호한 상태인지 확인하고, 부품이 새로운 원본 일치 데이터시트인지 확인합니다.

모든 상품을 포장한 후 문제가 없는지 확인한 후 안전하게 포장하여 글로벌 특급으로 보내드립니다. 우수한 밀봉 무결성과 함께 탁월한 천공 및 인열 저항성을 나타냅니다.

부품 포인트

The JS28F256P30BFE is a flash memory chip manufactured by Intel. It offers 256 megabits of storage capacity and uses a parallel interface. With fast read and program speeds, it's commonly used in embedded systems, consumer electronics, and industrial applications for data storage and firmware updates.
Equivalent

Equivalent products to the JS28F256P30BFE chip include the Intel 28F256P30B, SST28SF256P30B, and AM28F256P30BF. These chips share similar specifications and functionalities, making them suitable alternatives for various applications.
Features

1. 256Mb NAND Flash Memory 2. 3.0V Supply Voltage 3. Extended Temperature Range: -40°C to 85°C 4. Small Form Factor: 48-ball FBGA 5. High Speed Interface: 50ns Page Access Time 6. Flexible Erase and Program Algorithms 7. Data Retention: 20 Years 8. Industry-Standard JEDEC Packaging
Pinout

The JS28F256P30BFE is a 256-megabit (32 megabyte) flash memory chip. It has a 64-pin count. The pins serve functions such as power supply, address input/output, data input/output, and control signals for reading, writing, and erasing data.
Manufacturer

The JS28F256P30BFE is manufactured by Intel Corporation, a leading American multinational corporation known for designing and manufacturing semiconductor chips and related products. Intel is one of the largest and most influential technology companies globally, particularly renowned for its microprocessors for personal computers.
Application Field

The JS28F256P30BFE is commonly used in embedded systems, telecommunications equipment, networking devices, and automotive electronics for storing firmware, boot code, and data. It's suitable for applications requiring reliable, high-density, non-volatile memory with fast read and write operations.
Package

The JS28F256P30BFE chip is a BGA package type, with a TSOP form factor, and a size of 49.21 mm x 25.61 mm.