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EP4CE55F23I7N

Name: EP4CE55F23I7N
Rating: 4.5 (10 reviews)

Introducing the EP4CE55F23I7N, a versatile product ideal for development projects

브랜드: Intel / Altera

제조업체부품 #: EP4CE55F23I7N

데이터 시트: EP4CE55F23I7N 데이터 시트 (PDF)

패키지/케이스: FBGA-484

상품 유형: FPGAs (Field Programmable Gate Array)

RoHS 상태:

재고상태: 9,829 PC, 새로운 원본

Warranty: 1 Year Ovaga Warranty - Find Out More

빠른 견적

다음에 대한 RFQ를 제출해 주십시오. EP4CE55F23I7N 또는 우리에게 이메일을 보내: 이메일: [email protected], 12시간 이내에 연락드리겠습니다.

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담당자 이름^*

회사

주목

EP4CE55F23I7N 일반적인 설명

The EP4CE55F23I7N is an advanced field-programmable gate array (FPGA) manufactured by Intel, formerly known as Altera. Part of the Cyclone IV E series, it boasts 55,000 logic elements (LEs) and 2,856 kilobits of embedded memory. This FPGA is optimized for digital signal processing (DSP) applications, with 352 embedded 18x18 multipliers for efficient execution. With its "I7" designation, it provides support for industrial-grade temperature ranges, enabling reliable operation in various environments. Moreover, it is equipped with diverse I/O interfaces including LVDS (low-voltage differential signaling) and GPIOs (general-purpose input/output). The "N" in the part number signifies its plastic quad flat pack (PQFP) package type, ensuring robust packaging. All in all, the EP4CE55F23I7N is a powerful and adaptable FPGA, offering a wide range of capabilities for sophisticated digital applications

특징

Low-cost, low-power FPGA fabric:
6K to 150K logic elements
Up to 6.3 Mb of embedded memory
Up to 360 18 × 18 multipliers for DSP processing intensive applications
Protocol bridging applications for under 1.5 W total power
Cyclone IV GX devices offer up to eight high-speed transceivers that provide:
Data rates up to 3.125 Gbps
8B/10B encoder/decoder
8-bit or 10-bit physical media attachment (PMA) to physical coding sublayer (PCS) interface
Byte serializer/deserializer (SERDES)
Word aligner
Rate matching FIFO
TX bit slipper for Common Public Radio Interface (CPRI)
Electrical idle
Dynamic channel reconfiguration allowing you to change data rates andprotocols on-the-fly
Static equalization and pre-emphasis for superior signal integrity
150 mW per channel power consumption
Flexible clocking structure to support multiple protocols in a single transceiver block
Cyclone IV GX devices offer dedicated hard IP for PCI Express (PIPE) (PCIe) Gen 1:
×1, ×2, and ×4 lane configurations
End-point and root-port configurations
Up to 256-byte payload
One virtual channel
2 KB retry buffer
4 KB receiver (Rx) buffer
Cyclone IV GX devices offer a wide range of protocol support:
PCIe (PIPE) Gen 1 ×1, ×2, and ×4 (2.5 Gbps)
Gigabit Ethernet (1.25 Gbps)
CPRI (up to 3.072 Gbps)
XAUI (3.125 Gbps)
Triple rate serial digital interface (SDI) (up to 2.97 Gbps)
Serial RapidIO (3.125 Gbps)
Basic mode (up to 3.125 Gbps)
V-by-One (up to 3.0 Gbps)
DisplayPort (2.7 Gbps)
Serial Advanced Technology Attachment (SATA) (up to 3.0 Gbps)
OBSAI (up to 3.072 Gbps)
Up to 532 user I/Os
LVDS interfaces up to 840 Mbps transmitter (Tx), 875 Mbps Rx
Support for DDR2 SDRAM interfaces up to 200 MHz
Support for QDRII SRAM and DDR SDRAM up to 167 MHz
Up to eight phase-locked loops (PLLs) per device
Offered in commercial and industrial temperature grades

명세서

매개변수	값	매개변수	값
Product Status	Active	Programmabe	Not Verified
Number of LABs/CLBs	3491	Number of Logic Elements/Cells	55856
Total RAM Bits	2396160	Number of I/O	324
Number of Gates	-	Voltage - Supply	1.15V ~ 1.25V
Mounting Type	Surface Mount	Operating Temperature	-40°C ~ 100°C (TJ)
Package / Case	484-BGA

배송

	배송비	리드타임
DHL	$20.00-$40.00 (0.50 KG)	2-5 날
페덱스	$20.00-$40.00 (0.50 KG)	2-5 날
UPS	$20.00-$40.00 (0.50 KG)	2-5 날
TNT	$20.00-$40.00 (0.50 KG)	2-5 날
EMS	$20.00-$40.00 (0.50 KG)	2-5 날
등기 항공 우편	$20.00-$40.00 (0.50 KG)	2-5 날

처리 시간: 배송비는 지역 및 국가에 따라 다릅니다.

지불

지불 조건		핸드 수수료
	은행 송금	US$30.00의 은행 수수료를 부과합니다.
	페이팔	4.0%의 서비스 수수료를 부과합니다.
	신용 카드	3.5% 서비스 수수료를 부과합니다.
	웨스턴 유니언	charge US.00 banking fee.
	돈 그램	US$0.00의 은행 수수료를 부과합니다.

보증

1. 귀하가 구입한 전자 부품에는 365일 보증이 포함되어 있으며, 우리는 제품 품질을 보장합니다.

2. 귀하가 받은 품목 중 일부가 완벽한 품질이 아닌 경우, 당사는 책임 있게 귀하의 환불 또는 교체를 준비할 것입니다. 그러나 품목은 원래 상태를 유지해야 합니다.

포장

단계1 :제품
단계2 :진공 포장
단계3 :정전기 방지 가방
단계4 :개별 포장
단계5 :포장 상자
단계6 :바코드 배송 태그

모든 제품은 정전기 방지 가방에 포장됩니다. ESD 정전기 방지 보호 장치와 함께 배송됩니다.

외부 ESD 포장 라벨은 당사 정보(부품 번호, 브랜드 및 수량)를 사용합니다.

우리는 선적 전에 모든 상품을 검사하고, 모든 제품이 양호한 상태인지 확인하고, 부품이 새로운 원본 일치 데이터시트인지 확인합니다.

모든 상품을 포장한 후 문제가 없는지 확인한 후 안전하게 포장하여 글로벌 특급으로 보내드립니다. 우수한 밀봉 무결성과 함께 탁월한 천공 및 인열 저항성을 나타냅니다.

부품 포인트

The EP4CE55F23I7N is a field-programmable gate array (FPGA) chip produced by Intel. It features 55,000 logic elements, 1,518 Kbits of embedded memory, and 396 18 x 18 multipliers. This chip is commonly used in a variety of applications such as telecommunications, automotive, and industrial automation.
Equivalent

The equivalent products of EP4CE55F23I7N chip are Altera Altera Cyclone IV EP4CE55F23A7N, Altera Altera Cyclone IV EP4CE55F23I7, Altera Cyclone IV EP4CE55F23C6. These chips have similar specifications in terms of logic elements, memory blocks, and performance capabilities.
Features

The EP4CE55F23I7N is a Field Programmable Gate Array (FPGA) by Altera (now Intel) with 55,000 logic elements, 3,888 Kbits RAM, 475 multipliers, and 480 I/O pins. It supports 140 user I/O pins and is compatible with both VHDL and Verilog programming languages.
Pinout

The EP4CE55F23I7N is a 324-pin FPGA (Field-Programmable Gate Array) with 53,760 logic elements, 1,974 Kbits of RAM, and 360 18x18 multipliers. It also features differential I/O standards, gigabit transceivers, and support for various communication protocols such as PCI Express and Ethernet.
Manufacturer

The EP4CE55F23I7N is manufactured by Intel, which is a multinational technology company specializing in semiconductor manufacturing and computing innovation. Intel is known for producing a wide range of processors, memory chips, and other hardware products that power a variety of devices such as computers, smartphones, and servers.
Application Field

The EP4CE55F23I7N is commonly used in applications requiring high-performance programmable logic devices, such as telecommunications, data communication, and industrial automation. It is also well-suited for aerospace and defense, automotive, and consumer electronics. This versatile FPGA offers high logic density, high-speed interfaces, and abundant I/O options for demanding design requirements.
Package

The EP4CE55F23I7N chip is available in a BGA package with a size of 672-ball grid array. The form factor is surface mount and the dimensions are 23mm x 23mm.