BCM857BS-7-F

부품 포인트

• The BCM857BS-7-F is a high-speed dual PNP transistor chip manufactured by Diodes Incorporated. It is designed for general-purpose switching applications and features a low collector-emitter saturation voltage and fast switching speeds. The chip can be used in a variety of electronic devices, such as power management circuits, motor control systems, and audio amplifiers.

• Equivalent

  The equivalent products of the BCM857BS-7-F chip are the CMMB857BS and the CMMB857BG, both manufactured by NXP Semiconductors. These chips are dual PNP/PNP general purpose transistors and can be used as replacements for the BCM857BS-7-F chip in various applications.

• Features

  The BCM857BS-7-F is a small signal general purpose dual PNP transistor. It has a collector-emitter voltage of -45V, a collector current of -100mA, and a power dissipation of 200mW. The device is RoHS compliant and is specifically designed for use in switching and amplification applications.

• Pinout

  The BCM857BS-7-F is a dual NPN/PNP general-purpose transistor package. It has a pin count of 6, with the following functions: pins 1 and 2 are the Collector and Emitter of Transistor 1 (NPN), pins 3 and 4 are the Collector and Emitter of Transistor 2 (PNP), and pins 5 and 6 are connected internally for heat sinking purposes.

• Manufacturer

  The manufacturer of the BCM857BS-7-F is Diodes Incorporated. Diodes Incorporated is a leading global manufacturer and supplier of semiconductor products. They specialize in discrete, logic, and analog devices, serving various industries such as automotive, consumer electronics, and industrial sectors.

• Application Field

  The BCM857BS-7-F is a dual general-purpose bipolar junction transistor (BJT) that is commonly used in various low-power applications. It can be used in areas such as digital logic circuits, switching circuits, amplifiers, and small signal applications where moderate current and low voltage operation is required.

• Package

  The BCM857BS-7-F chip is a SOT-363 package type, which is a small, surface-mount package commonly used for integrated circuits. Its form is tape and reel, designed for automated surface-mount assembly. The size of the chip is compact, measuring approximately 2.00mm x 1.25mm x 1.15mm.